| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring board by which a plating resist having a shape for forming a fine-pitch wiring pattern layer (build-up wiring layer) and excellent dimensional accuracy can be formed surely. SOLUTION: The method of manufacturing a wiring board K includes a step of forming an insulating resin layer 12 containing an inorganic filler above a wiring layer 12 formed on the surface 2 of an insulating substrate 1; a step of roughening the surface of the insulating resin layer 12, and forming a thin copper layer 16 by electroless copper plating; and a step of forming an insulating film 18 on the thin copper layer 16. The method also includes a step of forming plating resists 18a and 18b following a prescribed pattern by exposing the insulating film 18 to the prescribed pattern and developing the film 18, and a step of forming wiring pattern layers 24 and 24a by copper electroplating on the surface of the insulating resin layer 12 having the formed plating resists 18a and 18b. The width of the plating resist 18b is adjusted to <20μm and the width of the gap 20 between the adjacent plating resists 18a and 18b is also adjusted to <20μm. COPYRIGHT: (C)2005,JPO&NCIPI |
