| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring circuit board capable of preventing short circuits among wires resulting from the melting of a metallic thin-film and an interface peeling between the metallic thin-film and a conductor layer, even when the conductor layer is formed by a fine wiring circuit pattern by an additive method and a tin plating layer is formed on the conductor layer. SOLUTION: The metallic thin-film 2 is formed on an insulating layer 1, and plating resists 3 are formed on the thin-film 2 in the inversion pattern of a wiring-circuit pattern. The conductor layers 4 are formed on the thin-film 2 exposed from the plating resists 3 in the wiring-circuit pattern. The tin plating layers 5 are formed on the conductor layers 4 exposed from the plating resists 3 by an electroless plating, and the plating resists 3 are removed. According to the method, the plating resists 3 function as barriers, and an infiltration to the thin-film 2 of a tin plating solution can be prevented because the tin plating layers 5 are formed under the state in which the plating resists 3 are formed. COPYRIGHT: (C)2005,JPO&NCIPI
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