| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein the number of components is large and manufacture takes time and effort so that the cost is high in the conventional thin unit. SOLUTION: A method for manufacturing a thin unit contains a process wherein a pair of component support plates 1 are stuck on one surface of a pressure sensitive adhesive sheet 2 kept with an interval; a process wherein electronic components 3 are mounted on the component support plate through the pressure sensitive adhesive sheet; a process wherein the pressure sensitive adhesive sheet is bent between the component support plates and a state in which the respective supporting surfaces face each other is obtained; a process wherein each of the component support plates on which the electronic component is mounted in the above state is accommodated in a metallic mold 4, the metallic mold is filled with melted resin 5, and the resin 5 is cured; a process wherein each of the support plates and the pressure sensitive adhesive sheet are detached from the resin by opening the metallic mold; and a process wherein conductor 6 which is electrically connected to the electronic components is formed on the resin. COPYRIGHT: (C)2005,JPO&NCIPI
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