发明名称 THROUGH HOLE INNER WALL ELECTRODE MATERIAL COATING METHOD AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a through hole inner wall electrode material coating method capable of stably carrying out an electrode material coating treatment on a large number of electronic parts and realizing enhancement of quality and reduction of cost. SOLUTION: A large number of electronic parts 1 having through holes 3 are arranged on an alignment frame 40, and when the through hole inner walls of the respective electronic parts 1 are coated with the electrode material 7 through a screen mask 5 by screen printing while air-sucking the through holes 3 of the electronic parts, regarding the electronic parts 1 among the electronic parts 1 arranged on the alignment frame 40 at a starting side of screen printing, an air suction amount of the through hole 3 is set to less degree, and regarding the electronic parts 1 at the finishing side of printing, an air suction amount of the through hole 3 is set to a larger amount than the starting side of printing. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005144220(A) 申请公布日期 2005.06.09
申请号 JP20030381082 申请日期 2003.11.11
申请人 TDK CORP 发明人 SATO TAKATERU;SAITO KATSUMI
分类号 B05D1/26;B05D7/00;H01F41/04;(IPC1-7):B05D1/26 主分类号 B05D1/26
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