| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for a TAB capable of realizing a high-density wiring, attaining weight saving and thinning while improving dimensional accuracy and positional accuracy in the case of transport, mounting and bonding in the tape carrier for the TAB. SOLUTION: In the tape carrier 1 for the TAB, a conductor pattern 7 in which the pitches of each wiring 8 are 60μm or less, and reinforcing layers 4 arranged at both side edges in the cross direction of insulating layers 2 and composed of a stainless foil along the longitudinal direction of the insulating layers 2 are formed on the surfaces of the insulating layers 2. In the tape carrier 1 for the TAB, the strength of the tape carrier 1 can be reinforced sufficiently in the case of the transport, the mounting and the bonding while the insulating layers 2 can be formed thinly. Since the reinforcing layers 4 are formed on the surfaces of the insulating layers 2, an electronic part can be mounted by an FC system while supporting the rear surfaces of the insulating layers 2 by planes. COPYRIGHT: (C)2005,JPO&NCIPI
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