摘要 |
An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips. |
申请人 |
THE CHARLES STARK DRAPER LABORATORY, INC. |
发明人 |
ANDERSON, RICHARD, S.;CONNELLY, JAMES, H.;HANSON, DAVID, S.;SOUCY, JOSEPH, W.;MARINIS, THOMAS, F. |