Arrangement of a chip package constructed on a substrate and substrate for production of the same

摘要

A packaged chip includes a substrate that includes flat and rigid supporting regions that are connected to an upper surface of the substrate. A chip is mounted face-down on the upper surface of the substrate such that a connection between the substrate and the chip extends virtually completely over one side of the chip. An encapsulating compound overlies a backside of the chip. Further, rigid supporting zones can be connected to the backside of the chip such that the supporting zones are at least partly interconnected with the encapsulating compound.