发明名称 HEAT DISSIPATION MEMBER, AND CIRCUIT BOARD AND SEMICONDUCTOR COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation member or the like which has a multilayer structure consisting of a ceramic member and a heatsink and can prevent a screwed portion from breaking against the tightening of an attachment screw. SOLUTION: The heat dissipation member 1 has such a structure that the ceramic member 1b is bonded to at least one face of the heatsink 1a formed of metal or the like, and has one or more screwed portions 2 in the form of a hole or notch. A cross section in the screw insertion direction of the screwed portions 2 is a stepped profile with the heatsink 1a protruding to the center of the screwed portion 2 while the ceramic member 1b relatively retreating outside of the screwed portion 2. Due to this structure, even if the attachment screw 4 inserted into the screwed portion 2 is caught in the heatsink 1a, it is hardly caught in the screwed portion 2 of the ceramic member 1b, remarkably reducing the probability of the breaking of the ceramic member 1b and hence increasing the reliability of the heat dissipation member 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150316(A) 申请公布日期 2005.06.09
申请号 JP20030384316 申请日期 2003.11.13
申请人 NGK SPARK PLUG CO LTD 发明人 TANAKA TOMOO;KATO TETSUYA;TSUBOI YOSHIKI;ITO MASAYA
分类号 H05K7/20;H01L23/40;H05K1/02;(IPC1-7):H01L23/40 主分类号 H05K7/20
代理机构 代理人
主权项
地址