发明名称 Substrate holder for plasma processing
摘要 An improved substrate holder comprises an electrode supporting a focus ring and a substrate, an insulating member surrounding the electrode and focus ring, a ground member surrounding the insulating member, and a focus ring surrounding the substrate. The focus ring provides a RF impedance substantially equivalent to a RF impedance of the substrate. A method of processing a substrate utilizing the improved substrate holder reduces arcing between the edge of the substrate and the focus ring. The method comprises the steps of placing the focus ring on the electrode, placing the substrate on the electrode and processing the substrate. Additionally, a method of controlling a focus ring temperature and a substrate temperature utilizing the improved substrate holder comprises the steps of placing the focus ring on the electrode, placing the substrate on the electrode, clamping the focus ring and the substrate to the electrode using an electrostatic clamp, supplying heat transfer gas(es) to the space residing between the focus ring and the electrode, and the space between the substrate and the electrode, and controlling the temperature of the electrode.
申请公布号 US2005120960(A1) 申请公布日期 2005.06.09
申请号 US20050506237 申请日期 2005.02.03
申请人 TOKYO ELECTRON LIMITED 发明人 CHEN LEE
分类号 H05H1/46;C23C16/00;H01J37/20;H01L21/00;H01L21/3065;H01L21/31;H01L21/683;H01L21/687;(IPC1-7):C23C16/00 主分类号 H05H1/46
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