发明名称 |
Laser beam machining method |
摘要 |
A laser material processing method for processing a printed wiring board to form a blind hole, a groove or a through hole by applying a laser beam to an insulating layer of the printed wiring board includes a first step of processing the insulating layer at a predetermined energy density, a second step of hardening the insulating layer by applying a laser beam at a lower energy density than the predetermined energy density of the first step around a processed portion processed in the first step, and a third step of removing the residual smear. |
申请公布号 |
US2005121613(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20040500253 |
申请日期 |
2004.06.25 |
申请人 |
ITO KENJI;TAKENO SHOZUI;KOBAYASHI NOBUTAKA |
发明人 |
ITO KENJI;TAKENO SHOZUI;KOBAYASHI NOBUTAKA |
分类号 |
B23K26/06;B23K26/38;B23K26/40;H05K3/00;H05K3/26;(IPC1-7):H01T19/04 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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