| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for sticking an adhesive tape on the rear of a semiconductor wafer capable of safely sticking the adhesive tape surely on the rear of the wafer to which a wafer-rear treatment is completed, and capable of sticking the adhesive tape on the rear of the wafer from the lower section of the wafer without wafer inversion so as to be able to effectively use a limited space such as a clean room. SOLUTION: The method for sticking the adhesive tape on the rear of the semiconductor wafer sticks the adhesive tape 11 on the rear of the semiconductor wafer W after the rear working treatment of the semiconductor wafer W. In the method, the wafer W is held under the state in which a surface, to which a pattern is formed, is directed upwards. In the method, the adhesive tape 11 is stuck on the rear of the wafer W from a lower section. COPYRIGHT: (C)2005,JPO&NCIPI |
