发明名称 SEMICONDUCTOR DEVICE STRUCTURE HAVING ETCH RESISTANT LINER ON TRANSISTOR GATE STRUCTURE AND ITS FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device structure for achieving a high device performance and to provide a method of forming the semiconductor device structure. SOLUTION: There is provided an etch resistant liner which covers a side wall of a transistor gate stack and resides along a part of a substrate at a lower part of the transistor gate stack. The liner prevents a silicide formation of the side wall of the gate stack which generates an electric shortage, and determines a location of the silicide formation within source and drain regions inside the substrate at the lower part of the transistor gate stack. The liner also covers a resistor gate stack and prevents the silicide formation in or adjacent to the resistor gate stack. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150713(A) 申请公布日期 2005.06.09
申请号 JP20040312244 申请日期 2004.10.27
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 NG HUNG Y;YANG HAINING S
分类号 H01L27/04;H01L21/302;H01L21/336;H01L21/822;H01L21/8234;H01L27/06;H01L29/78;(IPC1-7):H01L21/336;H01L21/823 主分类号 H01L27/04
代理机构 代理人
主权项
地址