发明名称 |
SEMICONDUCTOR DEVICE STRUCTURE HAVING ETCH RESISTANT LINER ON TRANSISTOR GATE STRUCTURE AND ITS FORMING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device structure for achieving a high device performance and to provide a method of forming the semiconductor device structure. SOLUTION: There is provided an etch resistant liner which covers a side wall of a transistor gate stack and resides along a part of a substrate at a lower part of the transistor gate stack. The liner prevents a silicide formation of the side wall of the gate stack which generates an electric shortage, and determines a location of the silicide formation within source and drain regions inside the substrate at the lower part of the transistor gate stack. The liner also covers a resistor gate stack and prevents the silicide formation in or adjacent to the resistor gate stack. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005150713(A) |
申请公布日期 |
2005.06.09 |
申请号 |
JP20040312244 |
申请日期 |
2004.10.27 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
NG HUNG Y;YANG HAINING S |
分类号 |
H01L27/04;H01L21/302;H01L21/336;H01L21/822;H01L21/8234;H01L27/06;H01L29/78;(IPC1-7):H01L21/336;H01L21/823 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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