| 摘要 |
PROBLEM TO BE SOLVED: To prevent a deterioration in display quality of a display device in a semiconductor device made by a connection to the display device by a COG packaging with the use of bumps formed on a transistor. SOLUTION: Bumps are formed only on a plurality of transistors composing a driving circuit and having the indentical type and size of a semiconductor device not to cause a difference in characteristic variations of transistors caused by a residual stress between adjacent output terminals, which causes no variation in output signal by the residual stress, being able to prevent the deterioration in display quality of the display device. COPYRIGHT: (C)2005,JPO&NCIPI
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