| 摘要 |
PROBLEM TO BE SOLVED: To predict and classify defects caused in a manufacturing process before an inspection and defects which might be caused in a manufacturing process after the inspection, make a short list of objects for a detailed inspection in a review apparatus from the classified result, and particularly highly accurately classify defects which might cause hole defects. SOLUTION: Use is made of an inspection data processing program comprising the steps 2 to 4 of reading from a storage device inspection result data involving defect information and design data of a circuit pattern formed in a working process after the inspection of an inspection object, and of the steps 6 to 10 of classifying defects which might be caused in the working process after the inspection owing to the defects on the basis of the inspection result data and the design data. COPYRIGHT: (C)2005,JPO&NCIPI
|
