| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition consisting essentially of (A) a liquid epoxy resin, (B) an aromatic amine-based curing agent, and (C) a silicone-modified epoxy resin represented by formula (1) (wherein R<SP>1</SP>is a hydrogen atom or a 1 to 4C alkyl group; R is an aliphatic-unsaturation-free substituted or unsubstituted monovalent hydrocarbon group; X is a divalent organic group; k and m are positive numbers which satisfy 0<k≤100, 0<m≤100, and 0<k+m≤200; and n is an integer in the range of 0 to 400) and to provide a semiconductor device sealed with a cured product thereof. SOLUTION: The liquid epoxy resin composition has a low viscosity and good workability, gives a cured product excellent in adhesion to the surface of a silicon chip, and provides a semiconductor device which is not defective when the temperature of reflow after moisture absorption is 260 to 270°C, does not deteriorate even under high-temperature and high-humidity conditions, and does not undergo peeling and cracking even after several hundred cycles in a temperature cycle of -65°C/150°C. COPYRIGHT: (C)2005,JPO&NCIPI
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