发明名称 |
Semiconductor device and method for fabricating the same |
摘要 |
A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
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申请公布号 |
US2005121761(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20050035986 |
申请日期 |
2005.01.18 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MAEDA KENJI;TAKATA TAKASHI;OCHI TAKAO;NARAOKA HIROKI;KAWABATA TAKESHI;ARAI YOSHIYUKI;NONOYAMA SHIGERU;HOMMA HAJIME |
分类号 |
H01L23/12;H01L21/56;H01L21/98;H01L23/29;H01L23/31;H01L25/065;H01L25/07;H01L25/18;H05K1/18;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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