发明名称 METAL-CLAD SUBSTRATE AND METHOD FOR PRODUCING SAME
摘要 <p>Disclosed is a metal-clad substrate wherein adhesion strength and adhesion stability between a metal and a plastic film are greatly improved. A multilayer plastic film is obtained by superposing a thermoplastic plastic film layer (2) on a base plastic film layer (3). Then, while controlling the temperature of the thus-formed multilayer plastic film, a metal layer (1) is formed on the thermoplastic plastic film layer (2) by a vapor phase method.</p>
申请公布号 WO2005051652(A1) 申请公布日期 2005.06.09
申请号 WO2004JP17470 申请日期 2004.11.25
申请人 DOWA MINING CO., LTD.;KOHAYASHI, SHUICHI;SAWABE, AKIO;KITAMURA, YUKIHIRO 发明人 KOHAYASHI, SHUICHI;SAWABE, AKIO;KITAMURA, YUKIHIRO
分类号 B32B27/08;H05K1/03;H05K3/14;(IPC1-7):B32B15/08;H05K3/24;H05K3/06 主分类号 B32B27/08
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