| 摘要 |
PROBLEM TO BE SOLVED: To provide a new epoxy resin curing agent useful for molding materials, various binders, coating materials, laminated materials, etc., imparting excellent heat-setting property in heat-setting when particularly used as a semiconductor sealing material and capable of forming an epoxy resin composition providing a cured material exhibiting low water absorption property and high glass transition temperature. SOLUTION: The polycondensation type aryloxysilane compound is obtained by reacting a dialkoxysilane compound with dihydric phenols in the presence of a carboxylic acid catalyst. The epoxy resin composition comprises the polycondensation type aryloxysilane compound as a curing agent. COPYRIGHT: (C)2005,JPO&NCIPI
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