| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite piezoelectric device whose packaging area is small when packaged on a packaging substrate, and to provide a manufacturing method thereof. SOLUTION: The composite piezoelectric device 10 has a configuration in which a piezoelectric device is joined to another piezoelectric device in a vertical direction via a lead frame 12, and the surroundings of the piezoelectric device and the other piezoelectric device are mold-sealed with a molding material 17. In this case, the lid of the piezoelectric device and the lid of the other piezoelectric device are positioned on the other side of the joining surface of the piezoelectric device and the other piezoelectric device. One end of the lead frame 12 protruding from the molding material 17 is bent downward along the molding material 17 to form packaging terminals 52. COPYRIGHT: (C)2005,JPO&NCIPI
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