| 摘要 |
A plasma processing apparatus includes a process chamber, a preliminary chamber which is disposed along a direction inclined with respect to a center axis of the process chamber and which is interruptibly communicated with the process chamber, a substrate electrode portion having a substrate placement surface on the top surface of which the substrate can be placed, a substrate electrode moving device for moving the substrate electrode portion between a plasma processing position within the process chamber and a substrate delivery position within the preliminary chamber while maintaining the substrate placement surface generally horizontal, and a lid portion which is provided in the preliminary chamber so as to be openable and closable. The substrate electrode moving device is operable to move the substrate electrode portion between the plasma processing position and the substrate delivery position along the inclined direction.
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