A printed circuit board assembly (10) employing a solder vent hole (32) adjacent solder filled interconnect vias (22) connecting to a conductive pallet (16), is disclosed. The solder vent hole (32) allows gases to escape from an otherwise sealed cavity (24) during solder reflow, relieving positive pressure and thereby allowing solder (26) to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste (26) to flow into the cavity (24).
申请公布号
WO2004107827(A3)
申请公布日期
2005.06.09
申请号
WO2004US15899
申请日期
2004.05.20
申请人
POWERWAVE TECHNOLOGIES, INC.;WONG, KENNETH, DARYL;BELL, SEAN, L.