发明名称 COMPONENT AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
摘要 A laminated component includes a conductive film layer and a non-functional film layer joined to a first surface of the conductive film layer. One of the two film layers has larger lateral dimensions than the other film layer such that a portion of the larger film layer extends beyond the other film layer. In one embodiment, the two film layers are joined together by a band of adhesive defining a sealed central area inwardly thereof, and the portion of larger film layer extends beyond the other film layer on all sides thereof.
申请公布号 WO2005029929(A3) 申请公布日期 2005.06.09
申请号 WO2004US30713 申请日期 2004.09.17
申请人 COPPER TO COPPER, LLC 发明人 RUSSELL, MILES, JUSTIN
分类号 B32B1/00;B32B1/04;B32B7/14;B32B15/04;B32B15/12;B32B15/20;B32B27/28;B32B27/30;B32B37/12;H01B13/00;H05K;H05K3/02;(IPC1-7):B32B15/20;B32B31/00 主分类号 B32B1/00
代理机构 代理人
主权项
地址