| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which anisotropic conductive paste is provided on terminals with a desired applied thickness at the time of providing the paste on the terminals and a semiconductor chip, and a circuit board is joined satisfactorily to each other. <P>SOLUTION: The method of manufacturing semiconductor device includes steps of: forming steps 5 by providing insulating layers 3 having heights higher than those of electrode pads 2 provided on a substrate 1 around the pads 2; of providing the anisotropic conductive paste 7 which is a paste material containing dispersed conductive particles in the steps 5, and electrically connecting the electrode pads 2 and the electrode terminals 9 of the semiconductor chip 8 to each other through the conductive particles provided in the steps 5. The heights of the steps 5 are set so that the parts 5 may hold the conductive particles. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
