| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate a sealing resin on a laminated chip to decrease a thickness, and to expand a metallic fine line toward the inside of the laminated chip, thereby reducing a mounting area. <P>SOLUTION: The other face of a first chip 1 formed with a bump 3 in an electrode pad on the one face is adhered to one face of a second chip 2 to form the laminated chip, and a metallic fine line 5 is expanded for connecting between respective electrode pads of the first chip 1 and the second chip 2. The electrode pad of the first chip 1 is connected to the electrode pad of the second chip 2 via the metallic fine line 5, to be connected to a bump 9 formed on a substrate 8 via the bump 3 of the first chip. The one face of the laminated chip composed of the first and second chips 1, 2 is reversed downward to be mounted onto the substrate 8 formed with the bump 9. A space between the laminated chip and the one face mounting the laminated chip of the substrate 8 is sealed with an underfill 4, and an external electrode terminal 7 is formed in the substrate 8 to obtain a chip laminated semiconductor device. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
