| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a device and to improve reliability by realizing preventing of positional deviation without introducing the complication of a manufacturing process. SOLUTION: A method of manufacturing the semiconductor device includes a first step of connecting the emitter 102 of an IGBT element 1 to the emitter circuit 202 of the substrate 2 simultaneously upon connecting of the gate 101 of the IGBT element 1 to the gate circuit 201 of the substrate 2, and a second step of connecting the collector 103 of the IGBT element 1 to the collector circuit of the substrate after the first step. COPYRIGHT: (C)2005,JPO&NCIPI |
