| 发明名称 |
Method of forming a polishing pad for endpoint detection |
| 摘要 |
A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
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| 申请公布号 |
US2005124273(A1) |
申请公布日期 |
2005.06.09 |
| 申请号 |
US20050031440 |
申请日期 |
2005.01.07 |
| 申请人 |
APPLIED MATERIALS, INC., A DELAWARE CORPORATION |
发明人 |
SWEDEK BOGUSLAW A.;BIRANG MANOOCHER |
| 分类号 |
B24B49/10;B24B37/00;B24B37/04;B24B49/00;B24B49/02;B24B49/12;B24D7/12;B24D11/00;B24D13/14;H01L21/304;(IPC1-7):B24D11/00 |
主分类号 |
B24B49/10 |
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