| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder joining method for efficiently and satisfactorily conducting and joining metallic members having different optical reflectances from each other at the wavelength of a laser beam used for joining by solder joining using irradiation with the laser beam while suppressing reflection, and electronic components such as an inductor provided with highly reliable solder joining of the metallic components having the different optical reflectances from each other. <P>SOLUTION: The solder joining method by irradiation with the laser beam includes: heating the portions where a metallic lead frames (a solder plating to phosphor bronze) 7 and a tangled part of a conductor (copper) 6 of the different optical reflectances are connected to each other; and heating solder by irradiation with the laser beam to conduct and join the portions by the molten solder. The laser beam is composed of an elliptic beam 14 of an oval shape, the metallic members are irradiated with the laser beam by deforming the regions to be irradiated with the laser beam in such a manner that the more thermal energy, as compared with that by the irradiation with one circular laser beam, is absorbed on the lead frame side 7 of the metallic member having the low optical reflectance. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
