发明名称 METHOD AND DEVICE FOR MOUNTING COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and a device for mounting component by which time required for mounting components on a printed board by means of a plurality of mounting heads is shortened effectively by performing highly accurate optimization adaptable to actual mounting work. <P>SOLUTION: The device mounts the electronic components on the printed board by means of a head unit provided with a plurality of mounting heads. The device is provided with an optimizing means 41 which decides the component mounting order on mounting points by means of the mounting heads during the course of mounting work, and a control means 42 which controls the mounting heads to mount the components in the order decided by the optimizing means 41. The optimizing means 41 finds the mounting order by which the time required for mounting the components becomes the shortest by calculating the time required for mounting cycles at every different case in which the component mounting order on the mounting points by means of the mounting heads is changed through simulation. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150387(A) 申请公布日期 2005.06.09
申请号 JP20030385649 申请日期 2003.11.14
申请人 I-PULSE CO LTD 发明人 TERAWAKI YOSHIHIDE
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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