Electropolishing apparatus, electropolishing method, and method of manufacturing semiconductor device

摘要

The formation of a groove wiring or a via contact which causes no retreat of a metal section by overpolishing by removing a section carrying little current which locally rises in a wafer face with the progress of electropolishing. In an electropolishing apparatus comprising a counter electrode ( 11 ) at a position facing a workpiece substrate ( 51 ), the counter electrode ( 11 ) consists of concentrically disposed electrodes ( 11 a- 11 e). Each of the electrodes ( 11 a- 11 e) has a power supply source ( 13 ) controlled independently and comprises a detector (unillustrated) for detecting a change in the current and voltage between each of the electrodes ( 11 a- 11 e) and the workpiece substrate ( 51 ) and a controller ( 15 ) for controlling a power supply to the electrodes ( 11 a- 11 e) on the basis of a change in the current and voltage detected by this detector.