发明名称 PRESS-FIT SEALED ELECTRONIC PART AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a press-fit sealed electronic part which is prevented from generating whiskers and capable of keeping a joint surface between a sealing canister and a plug unit airtight, and to provide a method of manufacturing the same. SOLUTION: The press-fit sealed electronic part is equipped with an electronic part 10, the plug unit 20, and a canister unit 30 which is sealed up by press-fitting the plug unit 20 to it. The plug unit 20 and the canister unit 30 are brought into close contact with each other through tin-free alloy layers 21 and 32. The method of manufacturing the press-fit sealed electronic part comprises processes of forming the plug unit 20 and the canister unit 30 by the use of a nickel silver material, plating them with tin-copper plating material 40, forming copper-zinc alloy layers 21 and 32 on an interface between the nickel silver material and the tin-copper plating material 40 by thermal treatment, exposing the copper-zinc alloy layers 21 and 32 to the outside by removing the tin-copper plating material, and bringing the plug unit 20 and the canister unit 30 into close contact with each other through the copper-zinc alloy layers 21 and 32 to subject them to press-fit sealing. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150322(A) 申请公布日期 2005.06.09
申请号 JP20030384563 申请日期 2003.11.14
申请人 SEIKO EPSON CORP 发明人 NISHIYAMA YOSHIHIDE
分类号 H01L23/06;H01L23/10;H01M2/36;H03H3/02;H03H9/02;H03H9/10;H03H9/19;(IPC1-7):H01L23/06 主分类号 H01L23/06
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