发明名称 |
Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same |
摘要 |
Disclosed is a semiconductor chip comprising power pads for receiving power, a plurality of pad groups grouped according to functions in such a manner that each pad group includes at least one input/output pad, separated power rings connected to each of pad groups and for delivering power supplied from the power pads to each of the pad groups, and a switch control unit for determining usage states for input/output pads of the pad groups and for performing on/off control with respect to each of the pad groups. The pad group comprises at least simultaneously-operating input/output pad, and is grouped in such a manner that the pad group includes at least two pads sharing power supplied from one power pad. A switch control unit determines a usage state for each of the pad groups and, as a result of the determination, turns off input/output pads of an idle pad group.
|
申请公布号 |
US2005121753(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20040002316 |
申请日期 |
2004.12.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JONG-RIM;IM JUNE-HYEOK;KIM DONG-YUN |
分类号 |
H01L21/822;G06F1/32;H01L21/82;H01L23/48;H01L23/495;H01L23/528;H01L27/04;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/822 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|