发明名称 SURFACE MOUNT HEADER ASSEMBLY
摘要 <p>A header assembly (200) includes an insulative housing (100) comprising a plurality of walls defining an interior cavity (108), and a plurality of contacts (150, 170) within said cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulating housing (100) comprises at least one alignment rib (136) extending on an exterior surface thereof. The contacts are formed to abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.</p>
申请公布号 WO2005053105(A1) 申请公布日期 2005.06.09
申请号 WO2004US38295 申请日期 2004.11.17
申请人 TYCO ELECTRONICS CORPORATION 发明人 FRY, DANIEL, WILLIAMS, JR.;MYER, JOHN, MARK;MOLL, HURLEY, CHESTER;SPITLER, ALEXANDRA, LYNNE, MATTHEWS;MATTHEWS, RANDY, THOMAS
分类号 H01R12/71;H01R43/02;(IPC1-7):H01R12/22 主分类号 H01R12/71
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