SEMICONDUCTOR LIGHT-EMITTING DEVICE MOUNTING MEMBER AND LIGHT-EMITTING DIODE USING SAME

摘要

Disclosed is a semiconductor light-emitting device mounting member (BL) which is formed by joining and integrating a base (1) with a heat-resistant resin member (2) via a joining layer (AL2). The base (1) has a first high heat-dissipating member (11), and the heat-resistant resin member (2) serves as a window frame. Also disclosed is a light-emitting diode (LE2) wherein a semiconductor light-emitting device (LE1) is mounted on the first high heat-dissipating member (11) of the semiconductor light-emitting device mounting member (BL) and sealed with a phosphor and/or a protective resin (FR), and a lens (LS) is arranged on a side from which light from the semiconductor light-emitting device (LE1) is taken out.