| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board provided with high reliability, wire-bonding suitability and package suitability; and to provide its manufacturing method. SOLUTION: An insulating resin film 21, consisting of a resin composition exhibiting solid state at normal temperatures and thermofusible; and a sheet-type reinforcing material 31 consisting of one of glass cloth, aramid nonwoven fabrics, and liquid crystal polymer nonwoven fabrics; are laminated on both sides of a core board 50 to apply smoothing treatment by a plate press machine to form insulating layers 46 on both sides of the core board 50. Next, via holes 53 are formed at predetermined positions on the insulating layers 46 by laser work, and a series of patterning treatment is applied through a subtractive method or a semi additive method, to form wiring layers 16a, 16b and vias 17 whereby a four-layered build-up wiring board 300 employing the insulating layers 46 can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI |
