INSPECTION METHOD AND INSPECTION DEVICE FOR THIN FILM DEVICE

摘要

PROBLEM TO BE SOLVED: To solve problems in forming a plug or wiring by means of CMP that an insufficient or excessive polishing amount causes a fault; therefore the both need inspection which need be separately made causing throughput to be lowered; and the both need to be quantitatively inspected at the same time. SOLUTION: A pattern is provided for making it possible to inspect unfinished polishing and the height (thickness) of a plug or of wiring at the same time, thereby making it possible to execute the two inspections at the same time. A plurality of patterns for inspection are prepared, thereby making possible an inspection equivalent to an inspection on the whole surfaces of a wafer and of a chip. COPYRIGHT: (C)2005,JPO&NCIPI