| 摘要 |
<P>PROBLEM TO BE SOLVED: To industrially provide an adhesive composition for semiconductor device, excellent in reflow thermal resistance and resistance to thermal cycle, and an adhesive sheet for semiconductor device, a substrate for connecting semiconductor and a semiconductor device which employ the adhesive composition. <P>SOLUTION: The adhesive composition for semiconductor device forms the adhesive agent layer of a substrate for connecting semiconductor, and is a thermosetting type adhesive agent containing (A) thermosetting resin, (B) thermoplastic resin, (C) inorganic filler and (D) at least one kind of silicone oil selected from alkyl denaturation, alkyl aralkyl denaturation, fatty acid ester denaturation, fluoro alkyl denaturation and methylstyryl denaturation. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
