发明名称 HEAT INSULATION BOARD FOR FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a heat insulation board for a floor for improving heat insulation as the whole floor by heat-insulating the part of a joist hardly damaging construction. SOLUTION: A wing-like heat insulation part for covering the lower face of the joist is provided on the side of a heat insulation body. In addition, a slit capable of bending the heat insulation board into a reverse V-shape is cut on the upper face of the center part of the heat insulation body in parallel to the wing-like heat insulation part to facilitate construction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005146760(A) 申请公布日期 2005.06.09
申请号 JP20030388941 申请日期 2003.11.19
申请人 MAG:KK 发明人 KUBONIWA SEIICHI;OTSUKI KIYOAKI
分类号 E04B1/80;E04B1/76;E04B5/43;(IPC1-7):E04B1/80 主分类号 E04B1/80
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