发明名称 |
HEAT INSULATION BOARD FOR FLOOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat insulation board for a floor for improving heat insulation as the whole floor by heat-insulating the part of a joist hardly damaging construction. SOLUTION: A wing-like heat insulation part for covering the lower face of the joist is provided on the side of a heat insulation body. In addition, a slit capable of bending the heat insulation board into a reverse V-shape is cut on the upper face of the center part of the heat insulation body in parallel to the wing-like heat insulation part to facilitate construction. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005146760(A) |
申请公布日期 |
2005.06.09 |
申请号 |
JP20030388941 |
申请日期 |
2003.11.19 |
申请人 |
MAG:KK |
发明人 |
KUBONIWA SEIICHI;OTSUKI KIYOAKI |
分类号 |
E04B1/80;E04B1/76;E04B5/43;(IPC1-7):E04B1/80 |
主分类号 |
E04B1/80 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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