CHARACTERISTIC INSPECTION DEVICE, CHARACTERISTIC INSPECTION METHOD, AND CHARACTERISTIC INSPECTION PROGRAM

摘要

PROBLEM TO BE SOLVED: To reduce resistance components in both a measuring electrode and a pad, while restraining a through-put from getting low. SOLUTION: When inspecting a characteristic of a semiconductor chip 4 mounted on a tape substrate 1 such as a TCP (tape carrier package), a current is made to flow for a short time via probes 13a, 13b to break impurities deposited on the pad before inspecting the characteristic of the semiconductor chip 4. A condition allowing the electric characteristic inspection is brought by removing the resistance components due to the impurities. COPYRIGHT: (C)2005,JPO&NCIPI