| 摘要 |
PROBLEM TO BE SOLVED: To efficiently prevent resin burrs from sticking to an exposed leadframe, including exposed leads 5 (9) and formed as attached to a resin molding 16 on a surface 7 not mounted with electronic components, of an encapsulated leadframe 22 encapsulated in a resin material (by en bloc one-side molding) with a required number of electronic components 3 mounted on a leadframe 1. SOLUTION: The leadframe 1 mounted with the electronic components 3 is fed into a mold setting section 13, and then the molding metals (top and bottom metals 11, 12) designed for encapsulating electronic components in a resin are fastened. The electronic components 3 are inserted into a molding metal cavity 15. The leadframe 1 is resin encapsulated with an elastic material 17 constituting the mold setting section 13 (setting surface 14), by elastically supporting backside where no elastic material 17 is mounted. COPYRIGHT: (C)2005,JPO&NCIPI
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