| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate drying apparatus for drying a substrate by steadily removing liquid in a short time at a space between the substrate holding section of a substrate holding mechanism and the substrate, and in their neighborhood. SOLUTION: The substrate drying apparatus has a substrate holding mechanism wherein a substrate (wafer Wf) is held and rotated on a substrate holding member 20 attached to the upper surface of an arm 10, so that liquid wetting the surface of the substrate is blown away by centrifugal force generated by the rotation of the substrate. A vacuum supplying means is provided in the substrate holder (contact section 25) of the substrate holding member, and the means sucks up and removes the liquid at the space between the substrate holding section of the substrate holding member and the substrate, and in their neighborhood. COPYRIGHT: (C)2005,JPO&NCIPI
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