发明名称 PRINTED WIRING-BOARD CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To arrange two printed wiring boards with ground layers or the ground layers near the ground layers up and down, and to reduce emitted noises generated in such a form that a signal is transmitted through an interboard cable. SOLUTION: Ground conductors 606 for master printed wiring boards and the ground conductors 607 for slave printed wiring boards are connected by metallic spacers 604 and metallic screws 605, respectively. However, the ground conductors for the slave printed wiring boards and the ground conductors for the master printed wiring boards are separated by forming slits near connecting points with the metallic spacers 604. The ground conductors 607 on the separated slave printed wiring boards and the ground conductors on the ground conductors for the master printed wiring boards are connected by chip resistors 608, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150161(A) 申请公布日期 2005.06.09
申请号 JP20030381582 申请日期 2003.11.11
申请人 CANON INC 发明人 HAYASHI YASUJI
分类号 H05K9/00;H05K1/02;H05K1/14;(IPC1-7):H05K1/14 主分类号 H05K9/00
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