发明名称 |
RESIN COMPOSITION CONTAINING INORGANIC POWDER, TRANSFER SHEET, METHOD OF MANUFACTURING DIELECTRIC LAYER FORMING SUBSTRATE, AND DIELECTRIC LAYER FORMINING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition containing an inorganic powder in which the dispersibility of the inorganic powder and a binder resin is superior, with which a film forming material layer having a smooth surface and a uniform film thickness can be formed, and further, with which a dielectric layer having no surface deffects and a fogging and having a high light transmittance and superior in optical characteristics can be formed after baking, and to provide a transfer sheet, a method of manufacturing dielectric layer forming substrate, and a dielectric layer forming substrate. SOLUTION: The resin composition containing the inorganic powder in this invention is characterised by containing a phosphate which has an oxyethylene group in the molecule in addition to the inorganic powder and the binder resin. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005146174(A) |
申请公布日期 |
2005.06.09 |
申请号 |
JP20030388048 |
申请日期 |
2003.11.18 |
申请人 |
NITTO DENKO CORP |
发明人 |
KOBAYASHI NATSUKI;BABA NORIHIDE;IKETANI MASAMITSU;ANDO MASAHIKO;KUME KATSUYA;NAKATSUKA YASUO;KANEDA MITSUHIRO;KAI MAKOTO |
分类号 |
C08L101/00;C08K3/00;C08K5/521;H01J9/02;H01J11/22;H01J11/34;H01J11/38;(IPC1-7):C08L101/00;H01J11/02 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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