发明名称 |
Method for attaching circuit elements |
摘要 |
A process for attaching a circuit element such as a capacitor to a substrate includes applying a conductive bonding material to electrical connections of the circuit element and/or substrate; placing the circuit element in position over the substrate; seating the circuit element in the conductive bonding material on the substrate; heating the bonding material to form a conductive bond; and applying a low viscosity wicking material around the area of the circuit element near the substrate. In some embodiments the conductive bonding material is a conductive epoxy such as silver or gold epoxy and the low viscosity wicking material is a flip chip underfill encapsulant.
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申请公布号 |
US2005121806(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20030729705 |
申请日期 |
2003.12.04 |
申请人 |
WHITE ELECTRONIC DESIGNS CORPORATION |
发明人 |
SANGIORGI JAMES A. |
分类号 |
H05K3/30;H05K3/32;H05K3/34;(IPC1-7):H01L23/28 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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