| 发明名称 |
Thermosetting resin composition and photo-semiconductor encapsulant |
| 摘要 |
A thermosetting resin composition comprising (A) a silicone compound containing at least two epoxy groups per molecule and having a molecular weight of 500-2,100, (B) an acid anhydride, and (C) an optional catalyst cures into a low stressed product having improved adhesion, heat resistance and moisture resistance and free of cure shrinkage.
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| 申请公布号 |
US2005123776(A1) |
申请公布日期 |
2005.06.09 |
| 申请号 |
US20040006711 |
申请日期 |
2004.12.08 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YOSHIKAWA YUJI |
| 分类号 |
C08G59/20;C08G59/42;C08K5/092;C08K5/5435;C08L83/04;C08L83/06;H01L23/28;H01L23/29;H01L23/31;H01L33/00;(IPC1-7):B32B9/04 |
主分类号 |
C08G59/20 |
| 代理机构 |
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