发明名称 |
Copper foil with low profile bond enhancement |
摘要 |
A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.
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申请公布号 |
US2005123782(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20050035468 |
申请日期 |
2005.01.13 |
申请人 |
CHEN SZUCHAIN F.;BRENNEMAN WILLIAM L.;VACCO ANDREW;YUKOV NINA |
发明人 |
CHEN SZUCHAIN F.;BRENNEMAN WILLIAM L.;VACCO ANDREW;YUKOV NINA |
分类号 |
B32B15/01;C25D1/04;H05K3/02;H05K3/38;(IPC1-7):B32B15/00;B21D39/00 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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