Inductive device including bond wires

摘要

An inductive device ( 105 ) is formed above a substrate ( 225 ) having a conductive coil formed around a core ( 109 ). The coil comprises segments formed from a first plurality of bond wires ( 113 ) and a second plurality of bond wires ( 111 ). The first plurality of bond wires ( 113 ) extends between the core ( 109 ) and the substrate ( 225 ). Each of the first plurality of bond wires is coupled to two of a plurality of wire bond pads ( 117, 116 ). The second plurality of bond wires ( 111 ) extends over the core ( 109 ) and is coupled between two of the plurality of wire bond pads ( 117, 119 ). A shield ( 141 ) includes a portion that is positioned between the core ( 109 ) and the substrate ( 225 ).