| 摘要 |
PROBLEM TO BE SOLVED: To reduce a molding defect in molding using a film and to improve the yield of a product. SOLUTION: A metallic mold 10 is idly clamped before a chip assembly body is arranged in a cavity 12a. A resin filling part 10a formed by idle clamping is sealed by an O ring 34. An upper film 8 and a lower film 9 are adsorbed in the sealed state. The films are made to follow the inner faces of the cavities 11a and 12a. Then, the chip assembly body is arranged in the cavity 12a, and it is mold-clamped and is molded. Thus, molding resin can be filled in the state where the films are made to follow the inner faces of the cavities 11a and 12a and therefore the dropping of the upper film 8 and the floating of the lower film 9 can be prevented. Then, a wire disconnection by the contact of the upper film 8 to the bonding wire can be prevented. |
