| 摘要 |
An electronic appliance (1) has a semiconductor chip (2) which is electrically conductively joined on at least one contact face, flat against a metallic conductor part (3) in which the conductor part has its rear face facing away from the semiconductor chip (2), joined flush with a metallic heat removal body (heat sink) (5). Between the foil (6) and conductor part (3) and/or between the foil and the heat removal body (5) is arranged a soft metallic layer (7,9). |
