| 摘要 |
A terminal obtained by forming a surface layer formed of an Sn-Ag-Cu ternary alloy with electroplating on a whole surface or a portion of a conductive base, wherein the Sn-Ag-Cu ternary alloy is constructed with a ratio of 70-99.8 mass % of Sn, 0.1-15 mass % of Ag and 0.1-15 mass % of Cu, has a melting point of 210-230 DEG C, and is formed in a state of a crystal of a minute particle as compared with the surface layer formed of Sn alone. <IMAGE> |
