| 发明名称 |
METHOD AND APPARATUS FOR AN IMPROVED UPPER ELECTRODE PLATE IN A PLASMA PROCESSING SYSTEM |
| 摘要 |
The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.
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| 申请公布号 |
KR20050053711(A) |
申请公布日期 |
2005.06.08 |
| 申请号 |
KR20057005446 |
申请日期 |
2005.03.29 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAIGUSA HIDEHITO;TAKASE TAIRA;MITSUHASHI KOUJI;NAKAYAMA HIROYUKI |
| 分类号 |
H01J37/32;(IPC1-7):H01L21/205 |
主分类号 |
H01J37/32 |
| 代理机构 |
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